Since its foundation, Canon Machinery Inc. has maintained an unwavering stance that emphasized technological development.
12-inch High performance Die Bonder for system in package
BESTEM-D531t will enable you to bond ultra precision bondingof NAND FLASH
Thin Die Capability
2 motion needleless pick up system, up to 15μm
Highest Accuracy Bonding Capability
Achieves die-bonding accuracy of ±8μm, θ=±0.05° (3σ)
Flexible Handling
Able to handle the lead frame size of ±1.0～25.0mm, and the substrate size of Length 100～300mm
High Performance Clip bonding System
Face-up / Face-down bonding flexible integration
Best TCO
High UPH,Small Foot Print,Minimized Conversion
Multi Dispense Head
Best Quality
High Accuracy
thermal management
Flexible Handling
Clip Size:1.0mm～
FC bonding:0.3mm～
with high quality
Automated Wire Bonding Inspection System
Epoch Making 3D Visual inspection
Only one second of measurement time, easy operations and flexible inspections.
High Accuracy Measurement
Height:1μm,3σ
Measurement Ability
Speed:1.0sec
Max measurement angle:±55°
3Ｄ/2Ｄ Data Acquisition
Data generated at once scanning
-Completely dry processing
-Setting of precise conditions is possible
-Supports fully automatic operation
-Automatic cutting function
| Dimension | W700 ×D1250×H1470 |
| Weight | Approx.250kg |
| Expand stroke | 7mm ×50mm(±0.1ｍｍ) *stopping precision :±0.1mm/sec |
| Vertical speed | 0.1mmｰ20mm/sec *adjusting rate :0.1mm/sec |
| temperature adjusment | room temperature to -80℃ |
| Size | 8" dicing frame. |
-Double catching protection device
-Processing speed adjustable function
-One-touch operation available for scheduling change (including up to 12")
-Smooth handling between processes
| Dimension | W2580 ×D1250×H1800 |
| Model | DFW-700 |
| Dicing frame | 8inch , 12inch |
| Clearning method | Scrub cleaning by melamine sponge |
| Drying method | Suction drying and Air blowing |
| Performance | Max.300pcs/Cart(LD/ULD) |
| Processing time | 12inch : Min 50sec. |
-Strictly eliminates dust causing factor
-Unigue balancing technology make it better performance (patent)
-Equipped with the ionizer and ULPA filter.
| Dimension | W1000 ×D1300×H1107 |
| Axis sealing | Forced vacuuming together with dust seal |
| Dicing frame and wafer | 12inch/ I or 2 cradle |
-Low-damage mounting to fragile wafers!
-The vacuum mounting method helps prevent air bubbles between the wafer and the tape.
-Provide the full-automatilon systems(option)
| Dimension | W500 ×D700×H945 |
| Weight | Approx.140kg |
| Recipe settings | choose from 10 types |
| Dicing frame settings | 2 to 8 inch * 12inch is nogotiable. |
| Tape suitable for processing | All kinds of tapes and adheasives |
Multi Reflow
1.All heating zone is available up to 350 degree
2.N2 machine achived oxgen concentration 200ppm (option/100ppm)
| Name | UNI-6116S |
|---|---|
| Power Requirement | 200V 18kVA (18KW) |
| Machine Weight | About 500kg |
| N2 Supply | More than 250L/minutes 0,4Mpa Purity more than 99,99% |
| Valid Width of Board | Pin Chain : 50 to 160mm Mesh : Max. 160mm |
| Conveyer Type | Pin chain system |
| Conveyer Speed | 0,1 to 0,5m/minutes |
| Conveyer Hight | 900+-20mm |
| Max Board Hight Number of Heater Panel Circulation Fan |
Refer to structure spec chart |
Option ( Option)
| Name | UNI-6116S |
|---|---|
| Over heating protection | |
| Mesh conveyor | |
| Conveyor automatic width adjustment | |
| Anti warping system | |
| anti warping automatic position adjusment | |
| Circulation fan stop detection | |
| N2 specification | |
| Oximeter | |
| Oxygen concentration controller | |
| 100ppm optional | |
| Flux removal system | |
| UPS | |
| Color order |
1. 35 years experience in LED/LSI industry for any size Wafer or PKG level worldwide.
2. Reliable Japanese quality
3. System with simple design, easy maintenance.
4. JEITA/ESDA/JEDEC/AEC standard.
5. Capable of testing HBM,MM and HMM.
N5100D
N5100D Specification
N5000
N5000 Specification
Ishihara Chemical's metal surface finishing agents (plating chemicals) is characterized by exceptional technical development capabilities for REACH-compliant plating chemicals, extensive evaluation capabilities for surface finishing by those products, and unparalleled technical service. In particular, our tin and tin alloy plating chemicals boast top share in the domestic Japanese market and we provide sales and technical support not only in Japan, but also in markets worldwide, particularly in China and throughout Asia.
Sn Plating for Connector Middle - speed matte plating process(10~20A/dm2)
PS-098S
For use with middle- and high-speed matte plating processes. Provides particularly excellent solderability and whisker prevention. Has tolerance for impurities and shows excellent stability.
Sn Plating for Lead frame High-speed matte plating process(10~40A/dm2)
PS-200
For use with high-speed matte plating processes. Provides particularly excellent macrothrowing power and uniformed surface. easy to manage chemical and shows excellent stability.
Neutral Sn Plating for Capacitor Barrel matte plating process
NB-RZS
For use with middle- and high-speed matte plating processes. Provides particularly excellent solderability and whisker prevention. Has tolerance for impurities and shows excellent stability.
NB-ZZBK
Can be operated at wide control range and simple bath control. Provides particularly excellent anti-corrosion and solderability. Recommend for use with chip components such as resistors that require high-speed performance.
Cu plating for PCB
TXV 40
For use with via filling. Provides perticularly excellent filling performance and flat surface.
BSC20
For use with circuit formation. Provides perticularly excellent uniformity and rectangular shape.
More details in Ishihara company web site
http://www.unicon.co.jp/english/
Origin offers the best solution in system and process for flux-less soldering. Ideal for high-quality soldering with formic acid reduction.
| Item | Spec. | |
|---|---|---|
| Machine dimension | W:3,240 x D:1,270 x H:2,114mm | |
| Gross weight | 1,700kg | |
| Control panel gross weight | 500kg | |
| Utility | Power 1（Main) | AC200～220V 50/60Hz 3Φ75A |
| Power 2（Heater) | AC200～220V 50/60Hz 3Φ175A | |
| Exhaust | 10m3/min Φ150mm | |
| Cooling water | 9～10L/min 0.5MPa Max.28℃ Φ12mm | |
| Compressed air 1 | 500L/min (Nor) 0.5-0.7MPa | |
| Compressed air 2 | 200L/min (Nor) 0.5-0.7MPa | |
| N2 | 350L/min (Nor) 0.2-0.5MPa | |
| Reduction agent | Liquid Formic Acid (HCOOH, 98%) | |
| Gas exhaust | Original decomposition system (general exhaust) | |
| Process area dimension | W:380 x D:310 x H:100mm | |
| Max. vacuum pressure reachable | Less than 20Pa | |
| Heating (for reduction & reflow) | IR heater, Max.400℃ | |
| Heating speed: Max. 300℃/min | ||
| Cooling | Water-cooled plate | |
| Cooling speed: Max. 200℃/min | ||
| Option |
|---|
| Auto Loader / Unloader |
| Carrier unload & return system |
| Production control system |
| Custom-made carriers |
| Additional thermocouples |
| & Others requested |
You'll get the various kinds of PCB substrates of single, both or multi layers based upon your demands. Especially it's well-established small and thin PCB substrate for chip LED applications.
For the demands of high thermal conductivity and high reflectivity, Al2O3 substrate is also available. According to the market trends, unique technology and material are developed. Material with high reflectivity is a example.
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